价格:￥888.00/支
品牌:松下
外观:黑色膏体
化学类型:环氧树脂
用途:芯片倒装底部填充
起订:1支
供应:1000支
发货:7天内

立即购买

 

 

This is one component epoxy for Flip-chip underfilling.

 

 

TYPICAL PROPERTIES

 

Properties	Unit	Data	Test Method
Viscosity(25oC)	Pa*s	20	KES-B-0102
Gelation time	sec	800	EKS-B-1051

 

 

RECOMMENDING PREHEAT CONDITION

temperature of substrate :  80～120oC

temperature of syringe :  R.T.～ 60oC

 

 

TYPICAL CURED PROPERTIES

Measurement Cure Conditions : 100'C2hour + 150`C 2hour

 

 

 

 

 

 

 

 

 

 

Properties Unit data Test Method Glass Trans. Temp. oC 160 KES-F-0001 C.T.E. ×10-5/oC 2.5 KES-F-0001 Flexural Strength MPa 160 KES-E-0104 Flexural Modulus GPa 9 KES-E-0104 Volume Resistivity Ω*cm 5×1015 KES-G-0023 Extractable Inpurity ion ppm Na+ : 4 KES-I-2011 A) Cl- : 8 Conductivity mS/m 4 KES-I-2001 A)

Treatment Conditions

 

(A):PCT with 10% water for 20hrs resin was cured and crushed

※Typical data

 

 

ATTENTION TO  STORAGE

・Stored compound must be thawed before use. Warm at room temperature until no longer cool to touch (about 2hrs).

・Please use up the material within 12 hrs.

・Compound must be stored in the cool condition with sealing.

・Please keep material under -40oC after receiving product.

 

 

ATTENTION TO HANDLING

・Please avoid direct contact with this product by wearing gloves, protecting gears,etc.

・Prevent frequent skin contact. If contact occurs, wash immediately with soap and water.

 

 

Encapsulation Materials Department	Phone number	81-59-346-3451
Plastic Materials Business Unit Electronic Materials Business Division   Panasonic Industory Co., Ltd	Fax number	81-59-346-9062

 

 

 

上海金泰诺材料科技有限公司是由在胶粘剂行业拥有10余年从业经验的专业人士创立，是一家专为电子、工业等制造领域客户提供胶粘剂解决方案的供应商。我们与GUO内外知MING胶粘剂厂家合作，组建了一支ZHUAN业销售及技术团队,只为在进口品牌替代、国外特殊产品引进以及产品的选择、应用及售后技术支持等方面，为您提供更JING准、更专业、更高XIAO的服务。

公司主要致力于为led照明、家用电器、消费电子、集成电路封装、光通信、新能源电池、汽车零部件、电源模块、风电、ar眼镜、智能水表、电机等行业用胶方案的提供。在胶粘剂方面，公司注重新材料的开发和应用，不断提升用胶产品的品质和性能，提高国内生产型企业产品在国内国JI市场的竞争力。积极配合和制定相关产品的粘结方案，解决行业内产品用胶难点的突破